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CONTACTUS

15223848168

PRODUCT

PRODUCT

Contacts

Contacts:

Xinxiu Zhu

Tel:

15223848168

Email:

sd02@qunwin.com

QQ:

876843941

Address:

Lidu Park,Fuling District,Chongqing,China

PRODUCT

BGA solder ball

      Solder ball is key part of a semiconductor packaging technology like BGA and CSP. Solder ball is technology-intensive product that transmit electric signals by connecting chips and boards.we can supply as small as 50um solder ball, and support custom specifications.

渝ICP备19012125号-1
在线,国产,有码,亚洲,欧美_2020手机福利视频_国产欧美国日产在线播放_日本欧美一级毛片