Lidu Park，Fuling District，Chongqing，China
ChongQing Qunwin Electronic Materials Co, Ltd. is a national high-tech innovative enterprise specializing in r&d and production of electronic packaging materials.
Our company has a number of related core technology patents.And it also is the owner of Taiwan and the mainland atomization forming BGA solder ball technology patent. Among them, the BGA solder ball which is less than 0.25mm is listed as one of the key projects of the national 863 Plan. The products comply with JIS Z3282-2006 standard and all have passed SGS certification. We have obtained ISO 9001 and 14001-2015 certificates.
Our company is the largest manufacturer of BGA solder balls in China. We have excellent research and development ability of solder ball, which can produce and meet all kinds of specifications of BGA/CSP/SMT.
The company has set up a new product research and development center, and has maintained a good cooperative relationship with many domestic universities.Our has been successful in the development of plain solder column, copper core soler balls, micro-spring column, Column with wrapped copper coil and other advanced packaging electronic solder materials, making up in the domestic technical gaps.